The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2024

Filed:

May. 27, 2021
Applicants:

The Regents of the University of California, Oakland, CA (US);

Nanotech Energy, Inc., Sunny Isles Beach, FL (US);

Inventors:

Maher F. El-Kady, Los Angeles, CA (US);

Richard B. Kaner, Pacific Palisades, CA (US);

Jack Kavanaugh, Los Angeles, CA (US);

Assignees:

The Regents of the University of California, Oakland, CA (US);

Nanotech Energy, Inc., Los Angeles, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 11/32 (2013.01); H01G 11/04 (2013.01); H01G 11/10 (2013.01); H01G 11/28 (2013.01); H01G 11/46 (2013.01); H01G 11/66 (2013.01); H01M 12/00 (2006.01);
U.S. Cl.
CPC ...
H01G 11/32 (2013.01); H01G 11/04 (2013.01); H01G 11/10 (2013.01); H01G 11/28 (2013.01); H01G 11/46 (2013.01); H01G 11/66 (2013.01); H01M 12/00 (2013.01); Y02E 60/13 (2013.01); Y02T 10/70 (2013.01);
Abstract

Provided herein are devices comprising one or more cells, and methods for fabrication thereof. The devices may be electrochemical devices. The devices may include three-dimensional supercapacitors. The devices may be microdevices such as, for example, microsupercapacitors. In some embodiments, the devices are three-dimensional hybrid microsupercapacitors. The devices may be configured for high voltage applications. In some embodiments, the devices are high voltage microsupercapacitors. In certain embodiments, the devices are high voltage asymmetric microsupercapacitors. In some embodiments, the devices are integrated microsupercapacitors for high voltage applications.


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