The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Oct. 24, 2019
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Hitoshi Ohkubo, Tokyo, JP;
Masazumi Arata, Tokyo, JP;
Kenichi Kawabata, Tokyo, JP;
Atsushi Sato, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/36 (2006.01); H01F 1/20 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/32 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2885 (2013.01); H01F 1/20 (2013.01); H01F 27/29 (2013.01); H01F 27/32 (2013.01); H01F 27/361 (2020.08);
Abstract
In a coil component, a shield layer is provided after the unevenness of the surface of an element body is smoothened by the surface being covered with an insulating layer. A Cu layer of the shield layer is provided on a smooth surface, and thus a thickness variation can be suppressed and the Cu layer can be formed with a substantially uniform thickness. In the coil component, a point where the shield layer is thin or a point lacking the shield layer is unlikely to be generated and a functional degradation of the shield layer is effectively suppressed.