The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Feb. 07, 2022
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Mayu Watanabe, Hachinohe, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 1/147 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/12 (2006.01); C22C 38/16 (2006.01); H01F 27/255 (2006.01);
U.S. Cl.
CPC ...
H01F 1/14766 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/12 (2013.01); C22C 38/16 (2013.01); H01F 27/255 (2013.01); C22C 2202/02 (2013.01);
Abstract
A soft magnetic powder including particles having a composition represented by FeCuNb(SiB)[provided that a, b, and x are each a number whose unit is at % and satisfy 0.3≤a≤2.0, 2.0≤b≤4.0, and 73.0≤x≤79.5, respectively, and y is a number satisfying f(x)≤y≤0.99, in which f(x)=(4×10)x], wherein the particle contains a crystal grain having a grain diameter of 1.0 nm or more and 30.0 nm or less, and includes a Cu segregated portion in which Cu is segregated, the Cu segregated portion is present at a position deeper than 30 nm from a surface of the particle, and a maximum Cu concentration in the Cu segregated portion exceeds 6.0 at %.