The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Jan. 12, 2023
Applicant:
Guobiao Zhang, Corvallis, OR (US);
Inventor:
Guobiao Zhang, Corvallis, OR (US);
Assignees:
HangZhou HaiCun Information Technology Co., Ltd., ZheJiang, CN;
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06N 3/063 (2023.01); G06F 9/30 (2018.01); G06F 13/40 (2006.01); G06F 15/80 (2006.01); G06F 18/21 (2023.01); G06F 21/56 (2013.01); G10L 15/183 (2013.01); G10L 15/22 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
G06N 3/063 (2013.01); G06F 9/3001 (2013.01); G06F 13/4004 (2013.01); G06F 15/803 (2013.01); G06F 18/21 (2023.01); G06F 21/561 (2013.01); G10L 15/183 (2013.01); G10L 15/22 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); G06F 2221/034 (2013.01); H01L 2224/08145 (2013.01); H01L 2225/06503 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06541 (2013.01);
Abstract
A discrete three-dimensional (3-D) processor a plurality of storage-processing units (SPU's), each of which comprises a non-memory circuit and more than one 3-D memory (3D-M) array. The preferred 3-D processor further comprises communicatively coupled first and second dice. The first die comprises the 3D-M arrays and the in-die peripheral-circuit components thereof; whereas, the second die comprises the non-memory circuits and off-die peripheral-circuit components of the 3D-M arrays.