The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Mar. 10, 2022
Advanced Micro Devices, Inc., Santa Clara, CA (US);
Pradeep Jayaraman, Santa Clara, CA (US);
Dean Gonzales, Fort Collins, CO (US);
Gerald R. Talbot, Boxborough, MA (US);
Ramon A. Mangaser, Boxborough, MA (US);
Michael J. Tresidder, Austin, TX (US);
Prasant Kumar Vallur, Bangalore, IN;
Srikanth Reddy Gruddanti, Bangalore, IN;
Krishna Reddy Mudimela Venkata, Bangalore, IN;
David H. McIntyre, Santa Clara, CA (US);
ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US);
Abstract
A semiconductor package for skew matching in a die-to-die interface, including: a first die; a second die aligned with the first die such that each connection point of a first plurality of connection points of the first die is substantially equidistant to a corresponding connection point of a second plurality of connection points of the second die; and a plurality of connection paths of a substantially same length, wherein each connection path of the plurality of connection paths couples a respective connection point of the first plurality of connection points to the corresponding connection point of the second plurality of connection points.