The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Aug. 30, 2019
Furukawa Techno Material Co., Ltd., Hiratsuka, JP;
Tohoku University, Sendai, JP;
Furukawa Electric Co., Ltd., Tokyo, JP;
Sumio Kise, Hiratsuka, JP;
Fumiyoshi Yamashita, Hiratsuka, JP;
Misato Fujii, Hiratsuka, JP;
Koji Ishikawa, Hiratsuka, JP;
Ryosuke Kainuma, Sendai, JP;
Toshihiro Omori, Sendai, JP;
Nobuyasu Matsumoto, Sendai, JP;
FURUKAWA TECHNO MATERIAL CO., LTD., Hiratsuka, JP;
TOHOKU UNIVERSITY, Sendai, JP;
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Abstract
A copper-based alloy material including a multiphase structure containing a matrix of a β phase and a precipitation phase of a B2-type crystal structure dispersed in the matrix, where the copper-based alloy material includes a composition containing 8.6 to 12.6% by mass of Al, 2.9 to 8.9% by mass of Mn, 3.2 to 10.0% by mass of Ni, and Cu.