The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2024

Filed:

Sep. 11, 2020
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Wenhai Mei, Beijing, CN;

Zhenqi Zhang, Beijing, CN;

Aidi Zhang, Beijing, CN;

Xiaoyuan Zhang, Beijing, CN;

Haowei Wang, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 11/02 (2006.01); B82Y 20/00 (2011.01); B82Y 40/00 (2011.01); C07C 59/90 (2006.01); C09D 11/037 (2014.01); C09D 11/50 (2014.01); C09K 11/88 (2006.01); H10K 50/115 (2023.01); H10K 71/13 (2023.01); H10K 85/30 (2023.01);
U.S. Cl.
CPC ...
C09K 11/025 (2013.01); C07C 59/90 (2013.01); C09D 11/037 (2013.01); C09D 11/50 (2013.01); C09K 11/883 (2013.01); H10K 85/381 (2023.02); B82Y 20/00 (2013.01); B82Y 40/00 (2013.01); H10K 50/115 (2023.02); H10K 71/13 (2023.02);
Abstract

The present disclosure relates to a ligand for a quantum dot, a ligand quantum dot, a quantum dot layer and a method for patterning the same. The surface of the ligand quantum dot of the present disclosure is connected with the cleavage-type ligand including a first ligand unit A, a cleavage unit B, and an adhesion adjusting unit C. The method includes: providing a substrate; coating a mixture containing the ligand quantum dot on the substrate to form a quantum dot film; exposing a preset region of the quantum dot film to ultraviolet light, so that the cleavage unit B in the cleavage-type ligand undergoes a photolysis reaction, and a molecular segment containing the adhesion adjusting unit C and obtained after decomposition is detached from a surface of the quantum dot; and washing off an unexposed region of the quantum dot film with an organic solvent, followed by drying.


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