The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Jan. 16, 2019
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
James William Stasiak, Corvallis, OR (US);
Garry Hinch, Corvallis, OR (US);
Stanley J. Kozmiski, San Diego, CA (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/037 (2014.01); B29C 64/153 (2017.01); B29K 509/02 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); C09D 11/102 (2014.01); C09D 11/106 (2014.01);
U.S. Cl.
CPC ...
C09D 11/037 (2013.01); B29C 64/153 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C09D 11/102 (2013.01); C09D 11/106 (2013.01); B29K 2509/02 (2013.01); B29K 2995/0003 (2013.01);
Abstract
A materials kit for three-dimensional (3D) printing can include a powder bed material including electroactive polymer particles including electroactive polymer having a melting temperature from about 100° C. to about 250° C. and a fusing agent including a radiation absorber to selectively apply to the powder bed material.