The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2024

Filed:

Nov. 28, 2019
Applicant:

Nova Chemicals (International) S.a., Fribourg, CH;

Inventor:

XiaoChuan Wang, Calgary, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/06 (2006.01); B01J 19/06 (2006.01); B01J 19/24 (2006.01); C08F 2/00 (2006.01); C08F 4/6592 (2006.01); C08J 5/18 (2006.01);
U.S. Cl.
CPC ...
C08L 23/06 (2013.01); B01J 19/06 (2013.01); B01J 19/245 (2013.01); C08J 5/18 (2013.01); C08F 2/001 (2013.01); C08F 4/6592 (2013.01); C08J 2323/06 (2013.01); C08J 2423/06 (2013.01); C08L 2203/16 (2013.01); C08L 2205/025 (2013.01); C08L 2205/24 (2013.01);
Abstract

A polyethylene homopolymer composition comprises: a first ethylene homopolymer having a density, dof from 0.943 to 0.975 g/cm, a melt index, Iof from 0.01 to 10 g/10 min, and a molecular weight distribution, Mw/Mn of less than 3.0; and a second ethylene homopolymer having a density, dof from 0.950 to 0.985 g/cm, a melt index, Iof at least 500 g/10 min, and a molecular weight distribution, M/Mof less than 3.0; wherein the ratio of the melt index, Iof the second ethylene homopolymer to the melt index, Iof the first ethylene homopolymer is at least 50. The polyethylene homopolymer compositions which may be nucleated have a weight average molecular weight, Mof ≤75,000, a high load melt index, Iof at least 200 g/10 min, a molecular weight distribution, M/Mof from 4.0 to 12.0 and may be usefully employed in molding applications, such as, for example, in compression molded closures.


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