The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2024

Filed:

Nov. 12, 2019
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Stephanie Silberstein Bell, North Andover, MA (US);

Thomas M. Hartnett, Nashua, NH (US);

Richard Gentilman, Acton, MA (US);

Derrick J. Rockosi, Lynn, MA (US);

Jeremy Wagner, Brighton, MA (US);

Assignee:

RAYTHEON COMPANY, Waltham, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C04B 37/00 (2006.01); C04B 35/01 (2006.01); C04B 35/44 (2006.01); C04B 35/645 (2006.01); C09K 11/08 (2006.01); C09K 11/77 (2006.01); G21K 4/00 (2006.01);
U.S. Cl.
CPC ...
C04B 37/003 (2013.01); C04B 37/005 (2013.01); C09K 11/08 (2013.01); C04B 2235/764 (2013.01); C04B 2237/10 (2013.01); C04B 2237/34 (2013.01);
Abstract

A method of bonding includes applying a glass composition to at least a first material surface. The glass composition includes a glass powder and a solvent. The first material surface is disposed onto a second material surface. An elevated temperature is applied to the first material surface and the second material surface to form a bond between the first material surface and the second material surface. The first material surface and the second material surface are compressed under an isostatic pressure.


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