The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2024

Filed:

Jun. 16, 2022
Applicant:

Hid Global Cid Sas, Suresnes, FR;

Inventor:

John Aldridge Keagy, Round Rock, TX (US);

Assignee:

HID Global CID SAS, Suresnes, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B42D 25/45 (2014.01); B29C 64/112 (2017.01); B29C 64/245 (2017.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B29L 17/00 (2006.01);
U.S. Cl.
CPC ...
B42D 25/45 (2014.10); B29C 64/112 (2017.08); B29C 64/245 (2017.08); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); B29L 2017/00 (2013.01);
Abstract

Techniques for using additive manufacturing for applying personalization or serialization information to a substrate are described herein. The techniques may include providing a base substrate formed from a first material such as polyvinyl chloride, polyester, or polycarbonate and applying, via an additive manufacturing process such as three-dimensional printing, a layer to at least a portion of the base substrate. The layer can include at least one of personalization or serialization information. The layer can be formed from the same material as the substrate or formed from a second material with substantially similar material properties as the substrate material.


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