The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Jul. 16, 2020
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventor:
Hiroshi Hamashima, Hikone, JP;
Assignee:
KYOCERA CORPORATION, Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
B30B 15/02 (2006.01); B22F 3/02 (2006.01); B22F 5/00 (2006.01); B30B 11/02 (2006.01);
U.S. Cl.
CPC ...
B30B 11/02 (2013.01); B22F 3/02 (2013.01); B22F 5/00 (2013.01);
Abstract
A molding die according to the present disclosure includes a tubular portion and a base portion that closes an end portion of the tubular portion at one side. A cut level difference Rδcin a roughness curve of an inner wall surface of the tubular portion is smaller than a cut level difference Rδcin a roughness curve of an inner wall bottom portion of the base portion. The cut level difference represents a difference between a cut level at a load length ratio of 25% in a roughness curve and a cut level at a load length ratio of 75% in the roughness curve.