The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Dec. 09, 2019
Nissei Plastic Industrial Co., Ltd., Nagano-ken, JP;
Hozumi Yoda, Hanishina-gun, JP;
Nobukazu Kasuga, Hanishina-gun, JP;
Hirofumi Murata, Hanishina-gun, JP;
NISSEI PLASTIC INDUSTRIAL CO., LTD., Nagano-Ken, JP;
Abstract
A molding injection pressure and a molding clamping force are determined in advance to obtain a parting opening amount, which is a predetermined gap, between a movable mold and a fixed mold of a mold during injection filling. The molding injection pressure and the molding clamping force are determined to obtain a molding injection pressure capable of molding a good product and a mold clamping force capable of molding a good product, respectively, thereby setting a specific molding condition, setting a fast injection speed from the start of injection, which is higher than the injection speed set by the specific molding condition, and setting a fast injection section for continuing the fast injection speed as a fast injection condition, mold-clamping the mold by the molding clamping force during molding, and setting the molding injection pressure to a limit pressure, injecting and filling resin into a mold by the fast injection condition from the start of injection, and injecting and filling resin by the specific molding condition when the fast injection section ends.