The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2024

Filed:

Oct. 27, 2021
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Satoshi Yamazaki, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/85 (2021.01); B33Y 50/02 (2015.01); B29C 64/393 (2017.01); B33Y 30/00 (2015.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
B22F 10/85 (2021.01); B29C 64/393 (2017.08); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 10/00 (2014.12);
Abstract

A three-dimensional shaped article production method for producing a three-dimensional shaped article by ejecting a shaping material to a stage and stacking layers according to a path including multiple partial paths is provided. The production method includes a first step of specifying a gap portion occurring inside the three-dimensional shaped article based on first shaping data having data for shaping a first portion that is a part of the three-dimensional shaped article by stacking layers having a first thickness and data for shaping a second portion that is adjacent to the first portion in a direction orthogonal to a stacking direction of the layers with a layer having a second thickness corresponding to a thickness of the first portion, a second step of generating second shaping data from the first shaping data by changing the first shaping data so as to fill up the gap portion when the gap portion is specified, and a third step of shaping the three-dimensional shaped article by ejecting the shaping material according to the second shaping data.


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