Power conversion device and motor-integrated power conversion device

Abstract

No consideration is given to heat transferred from a semiconductor module to a capacitor via a bus bar module. The heat generated by a semiconductor module () is transferred to a bus bar module () via a DC terminal (A) of the semiconductor module (). As illustrated in FIG.(B), the heat transferred to the bus bar moduleis then transferred to the pressing membervia the annular conductorand the boltA. Since the pressing memberis in close contact with the second coolerB, the heat transferred to the pressing memberis cooled by the second coolerB. On the other hand, the heat transferred to the convex portionA of the housingis transferred to the first coolerA via the housingand cooled. As a result, in the configuration in which a capacitor () is connected to the semiconductor module () via the bus bar module (), the heat transferred from the semiconductor module () to the capacitor () can be suppressed.