The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
Mar. 28, 2022
Applicant:
Hosiden Corporation, Osaka, JP;
Inventors:
Shunji Muraoka, Osaka, JP;
Shushin Noda, Osaka, JP;
Yoshifumi Yamanaka, Osaka, JP;
Kouta Onoyama, Osaka, JP;
Daisuke Kitaguchi, Osaka, JP;
Jun Miyajima, Osaka, JP;
Assignee:
HOSIDEN CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/04 (2006.01); H04R 1/08 (2006.01);
U.S. Cl.
CPC ...
H04R 1/04 (2013.01); H04R 1/083 (2013.01); H04R 2499/13 (2013.01);
Abstract
A microphone assembly comprises a circuit board, a microphone element connected to the circuit board, an external connection interface connected to the circuit board, and hot melt that is formed to cover the circuit board, the microphone element, and the external connection interface and has a hole formed to expose a part of the back side of the circuit board or the sound receiving part of the microphone element.