The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
Jun. 30, 2021
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Postech Research and Business Development Foundation, Gyeongsangbuk-do, KR;
Yeonwoo Kim, Gyeonggi-do, KR;
Wonbin Hong, Gyeongsangbuk-do, KR;
Junho Park, Gyeongsangbuk-do, KR;
Jaehyun Choi, Gyeongsangbuk-do, KR;
Sehyun Park, Gyeonggi-do, KR;
Sumin Yun, Gyeonggi-do, KR;
Abstract
An electronic device includes a housing including a first plate and a second plate; and a first antenna structure. The first antenna structure includes a board disposed between the first plate and the second plate. The board includes a first surface facing the first plate, a second surface facing the second plate, a plurality of insulating layers stacked on top of each other between the first surface and the second surface, a first conductive layer disposed on the first surface, a second conductive layer disposed on the second surface, a plurality of strips disposed between the plurality of insulating layers, and a plurality of vias connecting at least one or more of the first conductive layer, the second conductive layer, or the plurality of strips to each other and disposed in the plurality of insulating layers. The electronic device further includes a first conductive structure, a second conductive structure, a third conductive structure, and a fourth conductive structure formed as part of the plurality of strips and the plurality of vias; and a wireless communication circuit electrically connected to at least one of the vias and configured to transmit or receive at least one signal having a frequency of 3 GHz to 100 GHz.