The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2024

Filed:

Sep. 24, 2021
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Cheng-Fan Wei, New Taipei, TW;

Chao-Kuei Chang, Taipei, TW;

Yi-Hsiang Kung, Taipei, TW;

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 5/307 (2015.01); H01Q 1/02 (2006.01); H01Q 3/36 (2006.01); H01Q 7/00 (2006.01); H01Q 9/30 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/02 (2013.01); H01Q 3/36 (2013.01); H01Q 7/00 (2013.01); H01Q 9/30 (2013.01);
Abstract

Aspects described herein include devices, wireless communication apparatuses, methods, and associated operations for heatsinks integrating millimeter wave and non-millimeter wave operation. In some aspects, an apparatus comprising a millimeter wave (mmW) module is provided. The apparatus includes at least one mmW antenna and at least one mmW signal node configured to communicate a data signal in association with the at least one mmW antenna. The apparatus further includes mixing circuitry configured to convert between the data signal and a mmW signal for communications associated with the at least one mmW antenna. The apparatus further includes a heatsink comprising a non-mmW antenna and a non-mmW feed point coupled to the non-mmW antenna. The non-mmW feed point is configured to provide a signal path to the non-mmW antenna for a non-mmW signal. The heatsink is mechanically coupled to the mmW module.


Find Patent Forward Citations

Wei, Cheng-Fan. (2024). Heatsink for millimeter wave (mmw) and non-mmw antenna integration (U.S. Patent No. 11955688). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11955688

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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