The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2024

Filed:

Mar. 27, 2019
Applicants:

Samsung Sdi Co., Ltd., Yongin-si, KR;

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jungsue Jang, Yongin-si, KR;

Byungmin Lee, Yongin-si, KR;

Hana Kim, Yongin-si, KR;

Myungkook Park, Yongin-si, KR;

Seung Rim Yang, Seongnam-si, KR;

Bokyung Jung, Suwon-si, KR;

Minho Cho, Yongin-si, KR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 50/449 (2021.01); H01M 10/0525 (2010.01); H01M 50/403 (2021.01); H01M 50/411 (2021.01); H01M 50/42 (2021.01); H01M 50/426 (2021.01); H01M 50/431 (2021.01); H01M 50/443 (2021.01); H01M 50/446 (2021.01); H01M 50/457 (2021.01); H01M 50/46 (2021.01); H01M 50/491 (2021.01);
U.S. Cl.
CPC ...
H01M 50/449 (2021.01); H01M 10/0525 (2013.01); H01M 50/403 (2021.01); H01M 50/411 (2021.01); H01M 50/42 (2021.01); H01M 50/426 (2021.01); H01M 50/431 (2021.01); H01M 50/443 (2021.01); H01M 50/446 (2021.01); H01M 50/457 (2021.01); H01M 50/461 (2021.01); H01M 50/491 (2021.01);
Abstract

This application relates to a separator for a lithium secondary battery, a method for manufacturing a separator for a lithium secondary battery, and a lithium secondary battery including same. The separator includes a porous substrate, a heat resistant layer positioned on at least one surface of the porous substrate and including inorganic particles, and a first adhesive layer positioned on the heat resistant layer and including a first organic polymer. The heat resistant layer includes the inorganic particles of 90 wt % to 99 wt % on the basis of total weight, the thickness of the heat resistant layer is 3.5 μm to 7 μm, and the thickness of the first adhesive layer is 0.5 μm to 3.0 μm.


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