The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
Apr. 21, 2022
Innolux Corporation, Miao-Li County, TW;
Kai Cheng, Miao-Li County, TW;
Tsau-Hua Hsieh, Miao-Li County, TW;
Fang-Ying Lin, Miao-Li County, TW;
Tung-Kai Liu, Miao-Li County, TW;
Hui-Chieh Wang, Miao-Li County, TW;
Chun-Hsien Lin, Miao-Li County, TW;
Jui-Feng Ko, Miao-Li County, TW;
INNOLUX CORPORATION, Miao-Li County, TW;
Abstract
A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.