The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
Sep. 09, 2021
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Hiroshi Kono, Himeji Hyogo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Abstract
A semiconductor device of embodiments includes: a first electrode; a second electrode; a gate electrode extending in a first direction; a silicon carbide layer between the first electrode and the second electrode and including a first silicon carbide region of a first conductive type having a first region facing the gate electrode and a second region in contact with the first electrode, a second silicon carbide region of a second conductive type, and a third silicon carbide region of a second conductive type, the first region being interposed between the second silicon carbide region and the third silicon carbide region. A first width of the first region in a second direction perpendicular to the first direction is 0.5 μm or more than and 1.2 μm or less. A second width of the second region in the second direction 0.5 μm or more than and 1.5 μm or less.