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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11955517 B1

PDFFull Text
Date of Patent:
Apr. 09, 2024

Filed:

Nov. 15, 2020

Semiconductor devices including protruding insulation portions between active fins

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Shigenobu Maeda, Seongnam-si, KR;

Hee-Soo Kang, Seoul, KR;

Sang-Pil Sim, Seongnam-si, KR;

Soo-Hun Hong, Gunpo-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

Errol V Fernandes

Int. Cl.
CPC ...
H01L 21/8234 (2006.01); B82Y 10/00 (2011.01); H01L 21/84 (2006.01); H01L 27/088 (2006.01); H01L 27/12 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/16 (2006.01); H01L 29/161 (2006.01); H01L 29/165 (2006.01); H01L 29/417 (2006.01); H01L 29/49 (2006.01); H01L 29/51 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/775 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0692 (2013.01); B82Y 10/00 (2013.01); H01L 21/823431 (2013.01); H01L 21/845 (2013.01); H01L 27/0886 (2013.01); H01L 27/1211 (2013.01); H01L 29/0649 (2013.01); H01L 29/0653 (2013.01); H01L 29/0847 (2013.01); H01L 29/1037 (2013.01); H01L 29/1608 (2013.01); H01L 29/161 (2013.01); H01L 29/165 (2013.01); H01L 29/41791 (2013.01); H01L 29/4966 (2013.01); H01L 29/517 (2013.01); H01L 29/66795 (2013.01); H01L 29/7848 (2013.01); H01L 29/785 (2013.01); H01L 29/775 (2013.01);
Abstract

A semiconductor device can include a field insulation layer including a planar major surface extending in first and second orthogonal directions and a protruding portion that protrudes a particular distance from the major surface relative to the first and second orthogonal directions. First and second multi-channel active fins can extend on the field insulation layer, and can be separated from one another by the protruding portion. A conductive layer can extend from an uppermost surface of the protruding portion to cross over the protruding portion between the first and second multi-channel active fins.

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