The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2024

Filed:

Sep. 24, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Anshul Ashok Vyas, San Ramon, CA (US);

Liem Ferryanto, Gilroy, CA (US);

Binbin Wang, San Jose, CA (US);

Ravi C. Edupuganti, Austin, TX (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/52 (2006.01); G05B 19/418 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67253 (2013.01); C23C 16/52 (2013.01); G05B 19/4184 (2013.01); H01L 21/67276 (2013.01); H01L 22/12 (2013.01);
Abstract

A method of detecting failure causes in semiconductor processing systems may include receiving an indication of a failure in a semiconductor processing system and providing the indication of the failure as a query to a network representing the semiconductor processing system. The network may include nodes representing on-wafer effects and component functions, and relationships between the nodes that represent causal dependencies between the component functions and the on-wafer effects. The method may also include calculating a change in probabilities assigned to nodes representing the component functions resulting from the query, and generating an output indicating a probability of at least one of the component functions as a cause of the failure.


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