The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
Mar. 03, 2022
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Je Jung Kim, Suwon-si, KR;
Do Yeon Kim, Suwon-si, KR;
Jae Joon Lee, Suwon-si, KR;
Seung Ryeol Lee, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween and including a capacitance forming portion, by which capacitance of the multilayer electronic component is defined, having the first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween, cover portions disposed on two opposing surfaces of the capacitance forming portion in a first direction, and margin portions disposed on two opposing surfaces of the capacitance forming portion in a second or third direction, in which −3.0<{1−(Hc/H1)}×100≤0.4, where an average hardness of the cover portions is Hc and an average hardness of the first margin portions is H1.