The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
May. 21, 2020
Applicant:
Nextinput, Inc., Mountain View, CA (US);
Inventors:
Ali Foughi, Atherton, CA (US);
Julius Minglin Tsai, San Jose, CA (US);
Christopher Edwards, Sunnyvale, CA (US);
Assignee:
NextInput, Inc., Mountain View, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 5/20 (2006.01); G01J 5/00 (2022.01); G01J 5/02 (2022.01); G01J 5/58 (2022.01);
U.S. Cl.
CPC ...
G01J 5/20 (2013.01); G01J 5/0007 (2013.01); G01J 5/024 (2013.01); G01J 5/58 (2013.01);
Abstract
Described herein is a sensor in chip scale package form factor. For example, a non-vacuum packaged sensor chip described herein includes a substrate, and a sensing element arranged on the substrate. The sensing element is configured to change resistance with temperature. Additionally, the non-vacuum packaged sensor chip includes an absorbing layer configured to absorb middle infrared ('MIR') radiation.