The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
Mar. 07, 2022
Takashi Kasai, Kyoto, JP;
Koji Momotani, Kyoto, JP;
Takashi Kasai, Kyoto, JP;
Koji Momotani, Kyoto, JP;
MMI SEMICONDUCTOR CO., LTD., Tokyo, JP;
Abstract
A flow sensor chip includes a substrate in which a cavity having an opening is formed, a membrane provided on a surface of the substrate so as to cover the opening, a heater provided inside the membrane, a first thermopile and a second thermopile provided in the membrane, and a heat conduction member for heat conduction between the substrate and the membrane. A first hot junction and a first cold junction of a thermocouple provided in the first thermopile and a second hot junction and a second cold junction of a thermocouple provided in the second thermopile are arranged at positions overlapping with the opening in a plan view. The heat conduction member includes a first heat conduction member for heat conduction between the first cold junction and the substrate and a second heat conduction member for heat conduction between the second cold junction and the substrate.