The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2024

Filed:

Feb. 01, 2019
Applicant:

Mit Semiconductor Pte Ltd, Singapore, SG;

Inventors:

Kok Weng Wong, Singapore, SG;

Albert Archmawety, Singapore, SG;

Jun Kang Ng, Singapore, SG;

Chee Chye Lee, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 15/00 (2011.01); G01B 11/25 (2006.01);
U.S. Cl.
CPC ...
G01B 11/2504 (2013.01); G01B 11/2518 (2013.01); G06T 15/005 (2013.01);
Abstract

The invention includes a system and method for obtaining high-resolution 3D images of objects. The system includes three cameras and three light sources that have different wavelengths (e.g. a red light source, a blue light source and a green light source). Each camera simultaneously captures a color image of the object. A processor separates each of the red light images, the blue light images and the green light images into separate monochrome images using each of the red light source, blue light source and green light source. The quality of the images are not subject to limited resolution of conventional RBG images. Because three different wavelengths of light are used, the surface can be accurately imaged, regardless of its characteristics (e.g. reflectivity and transparency). The system is well suited for industrial uses that require a high volume of objects, particularly those of mixed material, to be rapidly inspected for defects as small as a few microns.


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