The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2024

Filed:

Jun. 11, 2019
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Kuan-Ting Wu, Taipei, TW;

Hsing-Hung Hsieh, Taipei, TW;

Super Liao, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 28/00 (2006.01); C09D 5/24 (2006.01); C09D 5/44 (2006.01); C25D 13/12 (2006.01);
U.S. Cl.
CPC ...
C23C 28/00 (2013.01); C09D 5/24 (2013.01); C09D 5/4411 (2013.01); C09D 5/443 (2013.01); C25D 13/12 (2013.01);
Abstract

A coated metal alloy substrate, a process for producing a coating a metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate comprises a passivation layer deposited on the metal alloy substrate, a porous conductive water borne carbon nanotube layer on the passivation layer, and an electrophoretic deposition layer deposited on the porous conductive water borne carbon nanotube layer.


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