The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
Feb. 07, 2018
Applicant:
Ppg Industries Ohio, Inc., Cleveland, OH (US);
Inventors:
Hongying Zhou, Allison Park, PA (US);
Masayuki Nakajima, Wexford, PA (US);
Kar Tean Tan, Wexford, PA (US);
Assignee:
PPG Industries Ohio, Inc., Cleveland, OH (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); B32B 27/38 (2006.01); C08G 18/20 (2006.01); C08G 18/22 (2006.01); C08G 18/28 (2006.01); C08G 18/32 (2006.01); C08G 18/58 (2006.01); C08G 18/76 (2006.01); C08G 18/80 (2006.01); C08G 59/40 (2006.01); C09D 5/24 (2006.01); C09J 11/08 (2006.01); C09J 175/00 (2006.01);
U.S. Cl.
CPC ...
C09J 175/00 (2013.01); C08G 18/2072 (2013.01); C08G 18/227 (2013.01); C08G 18/2855 (2013.01); C08G 18/3206 (2013.01); C08G 18/3215 (2013.01); C08G 18/3256 (2013.01); C08G 18/3271 (2013.01); C08G 18/58 (2013.01); C08G 18/76 (2013.01); C08G 18/7621 (2013.01); C08G 18/7671 (2013.01); C08G 18/80 (2013.01); C08G 18/8029 (2013.01); C08G 18/8074 (2013.01); C09D 5/24 (2013.01); C09J 11/08 (2013.01); C09J 163/00 (2013.01); C08L 2207/53 (2013.01);
Abstract
Disclosed herein is an adhesive composition comprising: an epoxy-containing component; and a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester, or thioester, or a combination thereof. Also disclosed are methods for forming a bonded substrate with the adhesive composition. Also disclosed is an article comprising first and second substrates and the adhesive composition.