The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
Aug. 21, 2019
Applicant:
Amcor Flexibles North America, Inc., Neenah, WI (US);
Inventors:
Michael D. Priscal, Neenah, WI (US);
Jacob A Lasee, Neenah, WI (US);
Assignee:
AMCOR FLEXIBLES NORTH AMERICA, INC., Neenah, WI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 65/40 (2006.01); B29C 51/14 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); C08J 5/18 (2006.01); C08K 3/26 (2006.01); B65D 75/32 (2006.01);
U.S. Cl.
CPC ...
B65D 65/40 (2013.01); B29C 51/14 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/306 (2013.01); B32B 27/327 (2013.01); C08J 5/18 (2013.01); C08K 3/26 (2013.01); B32B 2250/03 (2013.01); B32B 2250/04 (2013.01); B32B 2250/242 (2013.01); B32B 2250/246 (2013.01); B32B 2264/10 (2013.01); B32B 2264/104 (2013.01); B32B 2307/308 (2013.01); B32B 2307/31 (2013.01); B32B 2307/4023 (2013.01); B32B 2307/558 (2013.01); B32B 2307/72 (2013.01); B32B 2435/02 (2013.01); B32B 2439/70 (2013.01); B32B 2439/80 (2013.01); B65D 75/327 (2013.01); C08J 2323/06 (2013.01); C08J 2331/04 (2013.01); C08K 2003/265 (2013.01);
Abstract
The film structure has a first exterior layer having a high-density polyethylene and an inorganic particle, a second exterior layer having a polyethylene-based material for sealing, and an interior layer having a high-density polyethylene, a nucleating agent and a hydrocarbon resin. The film may be use as a heat-sealable lid component for packaging and offers high moisture barrier, good heat resistance, and push-through and/or child-resistance performance while maintaining an overall composition acceptable for recycling.