The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
Mar. 09, 2020
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Eric Thomas Martin, Corvallis, OR (US);
Gary G. Lutnesky, Corvallis, OR (US);
James R. Przybyla, Corvallis, OR (US);
Rogelio Cicili, San Diego, CA (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/045 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14072 (2013.01); B41J 2/04543 (2013.01); B41J 2/0458 (2013.01); B41J 2/04581 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/11 (2013.01); B41J 2202/20 (2013.01);
Abstract
In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a substrate and fluid actuators, the fluid actuators being disposed on the substrate. The fluidic die also includes a bond pad region defined on the substrate. The bond pad region includes a high aspect ratio power delivery bond pad with multiple bonding sites and a high aspect ratio power return bond pad with multiple bonding sites.