The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2024

Filed:

Dec. 18, 2020
Applicant:

Aecc Commercial Aircraft Engine Co., Ltd., Shanghai, CN;

Inventors:

Ting Zhang, Shanghai, CN;

Aihua Huang, Shanghai, CN;

Xiangqian Li, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2006.01); G01N 29/30 (2006.01);
U.S. Cl.
CPC ...
B32B 37/12 (2013.01); B32B 2037/1253 (2013.01); G01N 29/30 (2013.01);
Abstract

The present disclosure provides a method of manufacturing a bonding structural test block with defects. The method of manufacturing the bonding structural test block with defects includes: providing a first plate and a second plate; applying an adhesive on an upper surface of the first plate to form an adhesive layer; heating and curing at least partial region of the adhesive layer for the first time; placing the second plate on the adhesive layer; and heating and curing the adhesive layer for the second time to form a boding structural test block. According to the present disclosure, the at least partial region of the adhesive layer is heated and cured for the first time and chemical reaction occurs, so that the at least partial region forms a defect, and controllable manufacturing of the defect is realized. The test block with the defect is subjected to mechanical detection to simulate the actual defective product. Furthermore, according to the method provided by the present disclosure, weak bond defect and kiss-bonds defect with different bonding strength are simulated by controlling the percentage of the at least partial region in the entire region of the adhesive layer.


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