The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
Dec. 06, 2021
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Kenta Anegawa, Matsumoto, JP;
Tatsuya Tsuboi, Okaya, JP;
Fumiaki Akahane, Matsumoto, JP;
Yuka Wakuda, Chino, JP;
Assignee:
SEIKO EPSON CORPORATION, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/00 (2017.01); B29C 33/38 (2006.01); B29C 45/26 (2006.01); B29C 64/118 (2017.01); B29C 64/30 (2017.01); B33Y 10/00 (2015.01); B33Y 40/20 (2020.01); B33Y 80/00 (2015.01); B29K 505/12 (2006.01);
U.S. Cl.
CPC ...
B29C 64/118 (2017.08); B29C 33/3842 (2013.01); B29C 45/26 (2013.01); B29C 64/30 (2017.08); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 80/00 (2014.12); B29K 2505/12 (2013.01);
Abstract
A method for manufacturing a molding mold used in an injection molding apparatus includes: generating a first plasticized material by plasticizing a first shaping material containing an amorphous metal and a resin; and shaping a laminate that is a part of the molding mold by discharging the first plasticized material toward a stage to laminate a layer.