The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
May. 13, 2019
Dalian University of Technology, Liaoning, CN;
Guojun Ma, Liaoning, CN;
Chengwei Wu, Liaoning, CN;
Xiaolong An, Liaoning, CN;
Xiao Han, Liaoning, CN;
Wei Zhang, Liaoning, CN;
Yongtao Lv, Liaoning, CN;
Jianli Ma, Liaoning, CN;
DALIAN UNIVERSITY OF TECHNOLOGY, Liaoning, CN;
Abstract
A high aspect ratio in-plane metal microneedle array, a manufacturing method and a clamping and inserting auxiliary device thereof is disclosed. A large-size metal sheet is cut into small metal sheets. A clamping tooling composed of two upper and lower metal cover plates is processed. Inner sides of the upper and the lower cover plates of the tooling are provided with grooves in which the metal sheets are placed and fastened by bolts. Wire cutting is conducted on the tooling and the metal sheets as a whole to obtain a plane metal microneedle array with a plurality of microneedle bodies. In addition, an assembling and clamping device and an inserting auxiliary device of the high aspect ratio in-plane metal microneedle array is provided. The assembled inserting auxiliary device is placed on skin, and the microneedle array is inserted into the skin through the auxiliary device.