The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Mar. 30, 2018
Applicant:

Sharp Kabushiki Kaisha, Sakai, JP;

Inventors:

Tohru Okabe, Sakai, JP;

Shinsuke Saida, Sakai, JP;

Shinji Ichikawa, Sakai, JP;

Hiroki Taniyama, Sakai, JP;

Ryosuke Gunji, Sakai, JP;

Kohji Ariga, Aioi, JP;

Yoshihiro Nakada, Yonago, JP;

Koji Tanimura, Yonago, JP;

Yoshihiro Kohara, Yonago, JP;

Akira Inoue, Yonago, JP;

Hiroharu Jinmura, Yonago, JP;

Takeshi Yaneda, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/131 (2023.01); H10K 50/842 (2023.01); H10K 59/121 (2023.01); H10K 59/122 (2023.01); H10K 59/126 (2023.01); H10K 59/18 (2023.01);
U.S. Cl.
CPC ...
H10K 59/131 (2023.02); H10K 50/8426 (2023.02); H10K 59/1213 (2023.02); H10K 59/122 (2023.02); H10K 59/126 (2023.02); H10K 59/18 (2023.02);
Abstract

A first conductive layer in the same layer as that of a first electrode is coupled to a third conductive layer and a second electrode in the same layer as that of a third metal layer through a slit formed in a flattening film of a non-display area. Second conductive layers in the same layer as that of a second metal layer are provided to overlap with the slit.


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