The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Apr. 30, 2021
Applicant:

X Display Company Technology Limited, Dublin, IE;

Inventors:

David Gomez, Holly Springs, NC (US);

Christopher Andrew Bower, Raleigh, NC (US);

Raja Fazan Gul, Cork, IE;

António José Marques Trindade, Cork, IE;

Ronald S. Cok, Rochester, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); B41F 16/00 (2006.01); B65G 47/90 (2006.01); H03H 3/02 (2006.01); H03H 3/08 (2006.01); H05K 3/40 (2006.01); H10N 30/06 (2023.01); H01L 21/67 (2006.01); H10N 30/073 (2023.01);
U.S. Cl.
CPC ...
H05K 3/305 (2013.01); B41F 16/006 (2013.01); B65G 47/90 (2013.01); H03H 3/02 (2013.01); H03H 3/08 (2013.01); H05K 3/30 (2013.01); H05K 3/301 (2013.01); H05K 3/303 (2013.01); H05K 3/40 (2013.01); H05K 3/4007 (2013.01); H05K 3/4092 (2013.01); H10N 30/06 (2023.02); H01L 21/67144 (2013.01); H01L 2933/0066 (2013.01); H10N 30/073 (2023.02);
Abstract

A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.


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