The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Jun. 28, 2022
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventors:

Hidehiko Shimizu, Shizuoka, JP;

Tomohiro Sugiura, Shizuoka, JP;

Assignee:

YAZAKI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/10272 (2013.01);
Abstract

A flexible printed circuit includes: a chip component serving as an electronic component having a first electrode and the like; a base film; a conductive first pattern layer which is laminated on a portion of the base film and has a bonding region to which the electrode is, for example, soldered; and a coverlay laminated on the base film or the first pattern layer via an adhesive and having an opening for externally exposing a portion of the first pattern layer including the bonding region, and the chip component. The first pattern layer has a groove that opens in a range between the bonding region and an edge of the opening on a surface of the first pattern layer.


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