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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11950357 B1

PDFFull Text
Date of Patent:
Apr. 02, 2024

Filed:

Nov. 27, 2019

Circuit board for transmitting high-frequency signal and method for manufacturing the same

Applicants:

Qing Ding Precision Electronics (Huaian) Co.,ltd, Huai an, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Inventors:

Fu-Yun Shen, Shenzhen, CN;

Hong-Yan Guo, Shenzhen, CN;

Hsiao-Ting Hsu, New Taipei, TW;

Ming-Jaan Ho, New Taipei, TW;

Assignees:

QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Attorney:

ScienBiziP, P.C.

Primary Examiner:

Jeremy C Norris

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0237 (2013.01); H05K 1/092 (2013.01); H05K 3/0035 (2013.01); H05K 3/022 (2013.01); H05K 3/423 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/09563 (2013.01);
Abstract

A method for manufacturing a circuit board circuit board for transmitting high-frequency signal, including: providing a first-line circuit board (), a second circuit board (), at least one third circuit board (), a fourth circuit board (), a fifth circuit board (), and a sixth circuit board (); stacking the first circuit board (), the second circuit board (), and third circuit board () in that order, and stacking the fourth circuit board (), the sixth circuit board (), and the fifth circuit board () on the third circuit board (), and pressing them together to obtain the circuit board circuit board for transmitting high-frequency signal. The method manufacturing the circuit board circuit board for transmitting high-frequency signal can reduce a width of the transmission line. The present disclosure further provides the circuit board circuit board for transmitting high-frequency signal obtained by the above method.

Find Patent Forward Citations

Shen, Fu-Yun. (2024). Circuit board for transmitting high-frequency signal and method for manufacturing the same (U.S. Patent No. 11950357). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11950357

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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