The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2024
Filed:
May. 12, 2021
Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Hui Wen, Beijing, CN;
Lianbin Liu, Beijing, CN;
Hengzhen Liang, Beijing, CN;
Xu Lu, Beijing, CN;
Zhaolun Liu, Beijing, CN;
Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Abstract
The flexible circuit board includes: a substrate layer; a first conductive layer; a second conductive layer; a first cover film, a second cover film, a first electromagnetic shielding layer, and a second electromagnetic shielding layer. The part of the first cover film overlapping a first conductive portion has first hollow portions. The part of the second cover film overlapping a second conductive portion has second hollow portions. The orthographic projection of each first hollow portion on the substrate layer has an overlapping area with the orthographic projection of at least one second hollow portion on the substrate layer. The first electromagnetic shielding layer is coupled to the first conductive portion through the first hollow portions. The second electromagnetic shielding layer is coupled to the second conductive portion through the second hollow portions.