The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Mar. 15, 2021
Applicant:

Ideal Industries, Inc., Sycamore, IL (US);

Inventor:

Robert William Sutter, DeKalb, IL (US);

Assignee:

IDEAL Industries, Inc., Sycamore, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); B29C 65/06 (2006.01); B29C 65/08 (2006.01); H01R 43/02 (2006.01); H01R 43/24 (2006.01); B29L 31/36 (2006.01);
U.S. Cl.
CPC ...
H01R 43/0207 (2013.01); B29C 65/0672 (2013.01); B29C 65/08 (2013.01); H01R 43/24 (2013.01); B29L 2031/36 (2013.01);
Abstract

A method for joining two workpiece parts during a manufacturing process includes forming a first workpiece part having a first mating surface and forming a second workpiece part having a second mating surface. The first and second workpiece part may be separately distributed or may be joined for distribution. To join the parts, an energy director is formed in the first mating surface by an automated process, the energy director comprising an end portion projecting from the first mating surface such that the projecting end portion of the energy director engages the second mating surface when the first and second workpiece parts are brought into engagement with each other. In one example, the first and second workpiece parts are ultrasonically welded by pressing the parts together while vibrating at least one of the first workpiece part or the second workpiece part.


Find Patent Forward Citations

Loading…