The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2024
Filed:
May. 17, 2021
Applicant:
Seoul Viosys Co., Ltd., Gyeonggi-do, KR;
Inventors:
Namgoo Cha, Gyeonggi-do, KR;
Sang Min Kim, Gyeonggi-do, KR;
Seongchan Park, Gyeonggi-do, KR;
Yeonkyu Park, Gyeonggi-do, KR;
Jae Hee Lim, Gyeonggi-do, KR;
Jinkyu Jang, Gyeonggi-do, KR;
Assignee:
SEOUL VIOSYS CO., LTD., Ansan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H01L 33/22 (2010.01); H01L 33/46 (2010.01); H01L 33/54 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/22 (2013.01); H01L 33/46 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01);
Abstract
A unit pixel includes a transparent substrate, a plurality of light emitting devices arranged on the transparent substrate, connection layers electrically connected to the light emitting devices, and bonding pads disposed over the connection layers and electrically connected to the connection layers. The bonding pads are partially overlapped with at least one of the light emitting devices in a vertical direction, respectively.