The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Feb. 07, 2019
Applicant:

Osram Oled Gmbh, Regensburg, DE;

Inventors:

Benjamin Reuters, Regensburg, DE;

Johannes Saric, Regensburg, DE;

Jens Müller, Regensburg, DE;

Assignee:

OSRAM OLED GMBH, Regensburg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 33/30 (2010.01); H01L 33/40 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/005 (2013.01); H01L 33/30 (2013.01); H01L 33/405 (2013.01); H01L 33/486 (2013.01); H01L 2933/0066 (2013.01);
Abstract

In an embodiment, the optoelectronic semiconductor component () comprises a semiconductor layer sequence () with an active zone () for generating a radiation. On an bottom side () of the semiconductor layer sequence () there is an electrically insulating separation layer () with several openings (). An adhesion-promoting layer () is located next to the openings () on a side of the separation layer () facing away from the semiconductor layer sequence (). A continuous metallization layer () is located on a side of the adhesion-promoting layer () facing away from the semiconductor layer sequence (). The semiconductor layer sequence () is electrically contacted in the openings () directly by the metallization layer (). The metallization layer () and the openings () are spaced from the active zone () in the direction perpendicular to the separation layer ().


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