The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Jun. 09, 2022
Applicant:

Sony Group Corporation, Tokyo, JP;

Inventors:

Hideyuki Honda, Kanagawa, JP;

Tetsuya Uchida, Kanagawa, JP;

Toshifumi Wakano, Kanagawa, JP;

Yusuke Tanaka, Kanagawa, JP;

Yoshiharu Kudoh, Kanagawa, JP;

Hirotoshi Nomura, Kanagawa, JP;

Tomoyuki Hirano, Kanagawa, JP;

Shinichi Yoshida, Kanagawa, JP;

Yoichi Ueda, Kanagawa, JP;

Kosuke Nakanishi, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 21/76 (2006.01); H04N 25/67 (2023.01); H04N 25/70 (2023.01); H04N 25/74 (2023.01); H04N 25/75 (2023.01);
U.S. Cl.
CPC ...
H01L 27/1463 (2013.01); H01L 21/76 (2013.01); H01L 27/146 (2013.01); H01L 27/14603 (2013.01); H01L 27/14614 (2013.01); H01L 27/14621 (2013.01); H01L 27/14627 (2013.01); H01L 27/1464 (2013.01); H01L 27/14641 (2013.01); H01L 27/14689 (2013.01); H04N 25/67 (2023.01); H04N 25/70 (2023.01); H04N 25/75 (2023.01); H01L 27/14636 (2013.01); H01L 27/14645 (2013.01); H01L 27/14685 (2013.01); H04N 25/74 (2023.01);
Abstract

The solid-state imaging element includes a photoelectric converter, a first separator, and a second separator. The photoelectric converter is configured to perform photoelectric conversion of incident light. The first separator configured to separate the photoelectric converter is formed in a first trench formed from a first surface side. The second separator configured to separate the photoelectric converter is formed in a second trench formed from a second surface side facing a first surface. The present technology is applicable to an individual imaging element mounted on, e.g., a camera and configured to acquire an image of an object.


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