The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2024
Filed:
Jun. 23, 2021
Applicant:
Japan Display Inc., Tokyo, JP;
Inventor:
Kazuyuki Yamada, Tokyo, JP;
Assignee:
Japan Display Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 24/30 (2013.01); H01L 24/83 (2013.01); H01L 25/167 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/98 (2013.01); H01L 2224/29286 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29291 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/3003 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/83052 (2013.01); H01L 2224/83986 (2013.01); H01L 2924/12041 (2013.01);
Abstract
An electronic device comprising: an array substrate having a first electrode and a second electrode; a first connecting member arranged on the first electrode; a first LED chip mounted on the first connecting member; a second connecting member arranged on the second electrode and being thicker than the first connecting member; and a second LED chip mounted on the second connecting member. A distance from a reference surface of the array substrate to a top surface of the second connecting member is larger than a distance from the reference surface to a top surface of the first connecting member.