The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Dec. 05, 2019
Applicant:

Toshiba Mitsubishi-electric Industrial Systems Corporation, Chuo-ku, JP;

Inventors:

Takayuki Furuya, Tokyo, JP;

Akira Kagami, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/492 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 23/4922 (2013.01); H01L 25/071 (2013.01);
Abstract

An element module includes a cooler, a plurality of elements, and a conductive member. The cooler includes a first element disposition portion and a second element disposition portion which are provided on both sides in a predetermined direction. The plurality of elements are disposed in each of the first element disposition portion and the second element disposition portion. The conductive member is disposed in a space portion of the cooler. The space portion penetrates the cooler between the plurality of elements in each of the first element disposition portion and the second element disposition portion. The space portion allows the first element disposition portion and the second element disposition portion to communicate with each other. The conductive member is connected to the element of the first element disposition portion and the element of the second element disposition portion.


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