The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2024
Filed:
Nov. 06, 2018
Applicant:
Siemens Aktiengesellschaft, Munich, DE;
Inventor:
Daniel Reznik, Berlin, DE;
Assignee:
SIEMENS AKTIENGESELLSCHAFT, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); B22F 10/28 (2021.01); H01L 21/48 (2006.01); B33Y 80/00 (2015.01); C22C 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3733 (2013.01); B22F 10/28 (2021.01); H01L 21/4871 (2013.01); H01L 23/3736 (2013.01); B33Y 80/00 (2014.12); C22C 29/065 (2013.01);
Abstract
Various embodiments include a heat sink comprising: a base plate with an assembly surface for an electronic component; and a cooling structure bonded to the base plate increasing a surface area of the heat sink. The base plate comprises a metal-ceramic composite with a ceramic phase and a metallic phase. The cooling structure comprises a metal. A bond between the cooling structure and the base plate consists of a purely metallic bond between the cooling structure and the metallic phase of the base plate.