The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2024
Filed:
Mar. 11, 2021
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventor:
Koo Woong Jeong, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 21/486 (2013.01); H01L 21/56 (2013.01); H01L 23/3135 (2013.01); H01L 23/49527 (2013.01); H01L 23/49537 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49861 (2013.01); H01L 23/5389 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06582 (2013.01);
Abstract
A package-embedded board includes: a core layer having a through-hole portion; a package at least partially disposed in the through-hole portion and including a die pad, an electronic component disposed on the die pad, and a molded portion covering the electronic component; and a core insulating material disposed in the through-hole portion and covering the core layer and the package.
Jeong, Koo. (2024). Package-embedded board (U.S. Patent No. 11948849). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11948849
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile