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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11948809 B1

PDFFull Text
Date of Patent:
Apr. 02, 2024

Filed:

Sep. 14, 2021

Method for underfilling using spacers

Applicant:

Delphi Technologies Ip Limited, St. Michael, BB;

Inventor:

Whei Sheng Tan, Woodlands, SG;

Assignee:

Delphi Technologies IP Limited, St. Michael, BB;

Attorneys:

Joshua M. Haines

Bookoff McAndrews, PLLC

Primary Examiner:

Marcos D Pizarro

Assistant Examiner:

William Henry Anderson

Int. Cl.
CPC ...
H01L 23/16 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 23/16 (2013.01); H01L 23/49816 (2013.01); H01L 24/10 (2013.01); H05K 1/181 (2013.01); H01L 2224/10155 (2013.01); H05K 2201/10568 (2013.01);
Abstract

A method for underfilling an electronic circuit assembly may include mounting one or more structures to a substrate, mounting one or more spacers to the substrate at one or more positions, respectively, to form one or more passages between the one or more spacers and the one or more structures, dispensing underfill to the one or more passages, and curing the underfill to secure the one or more structures to the substrate. The one or more structures may include one or more dies.

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Quick Actions:

Tan, Whei. (2024). Method for underfilling using spacers (U.S. Patent No. 11948809). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11948809

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