The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Mar. 30, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Matthew Doyle, Chatfield, MN (US);

Thomas W. Liang, Rochester, MN (US);

Layne A. Berge, Rochester, MN (US);

John R. Dangler, Rochester, MN (US);

Jason J. Bjorgaard, Rochester, MN (US);

Kyle Schoneck, Rochester, MN (US);

Matthew A. Walther, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/485 (2013.01); H05K 3/4007 (2013.01); H05K 2203/043 (2013.01);
Abstract

A set of features for a product is identified. It is determined that preventing an electrical connection at a ball-grid-array location on a ball-grid-array assembly of the product would result in the set of features. The ball-grid-array location is established as a target BGA location based on that determination. Suction is applied to a via at the target BGA location during reflow of the ball-grid-array assembly. With that application of suction, a solder ball at the target BGA location is drawn into the via.


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