The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2024
Filed:
Nov. 30, 2018
Applicant:
Hamamatsu Photonics K.k., Hamamatsu, JP;
Inventors:
Masahiro Kotani, Hamamatsu, JP;
Takayuki Ohmura, Hamamatsu, JP;
Assignee:
HAMAMATSU PHOTONICS K.K., Hamamatsu, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 49/04 (2006.01); C25D 1/00 (2006.01); C25D 1/20 (2006.01); C25D 5/02 (2006.01); C25D 11/02 (2006.01); C25D 11/12 (2006.01); G01N 27/623 (2021.01);
U.S. Cl.
CPC ...
H01J 49/0409 (2013.01); C25D 1/00 (2013.01); C25D 1/20 (2013.01); C25D 5/02 (2013.01); C25D 11/022 (2013.01); C25D 11/12 (2013.01); G01N 27/623 (2021.01);
Abstract
A sample support body is a sample support body for ionizing a sample, including: a substrate formed with a plurality of first through holes opening to a first surface and a second surface opposite to each other; and a conductive layer provided at least on a peripheral portion of the first through hole in the first surface, in which in a partition portion provided between the adjacent first through holes, a plurality of second through holes communicating the adjacent first through holes are formed.